3D Sensing

3D SENSING VCSEL

Feature

940nm / 850nm Vertical-Cavity Surface-Emitting Laser Array

Very low wavelength-temperature sensitivity

High uniformity and reliability

3D sensing such as Structured light / iToF /dToF、Active binocular etc.

Other wavelengths, chip dimensions, and emitter patterns are available upon request

Applications

TWS Headset

Mobile phone / Pad

Smart cleaning robot

Intelligent door lock / Access control

AR / VR

Chip List

Product	Proximity Sensing		Structured light	iToF		dToF
	1孔	20孔	單結(jié)2W	單結(jié)2W	單結(jié)3W	單結(jié)1×16尋址
Emitter	1	20	212	250	500	65
Power（W）	0.01	0.2	2.1	2	3.1	0.8
Voltage（V）	2.1	2.1	2.2	2.1	1.9	2.3
PCE	50%	45%	43%	45%	41%	43%
Current（mA)	10	200	2200	2100	4000	800
Chip Design

Note: The tri- junction products of the above 3D sensing products have shown excellent performance of slope ≈ 3.0W/A and Voltage ≈ 4.7V. Under the same driving current, the maximum output power of the above products is expected to be increased by 3X.

Typical performance curve

*Typical iToF single junction 2W LIV and PCE curves at 25 ℃

Product Consulting